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Re: [jakarta.ee-spec] BALLOT: Approval to Release CDI 3.0

+1 Tomitribe

Our +1 comes with the caveat that we're aware the Compatible Implementation does not pass all tests contained in the TCK and this is not strictly ok per the JESP which requires all optional TCK tests to have been passed.  The +1 is an acknowledgment that "we are where we are" and to address this for CDI would take a significant amount of work.  Other specifications over the coming years should not use CDI as an example it is ok to not pass optional tests.



On Mon, Aug 31, 2020 at 3:09 PM Kevin Sutter <sutter@xxxxxxxxxx> wrote:
Greetings Jakarta EE Specification Committee - Let's try this again!  :-)

 

I need your vote to approve and ratify the release of Jakarta CDI 3.0 as part of the Jakarta EE Platform 9 release.

 

The JESP/EFSPrequires a successful ballot of the Specification Committee in order to ratify the products of this release as a Final Specification (as that term is defined in the EFSP).

 

The relevant materials are available here:

 
https://github.com/jakartaee/specifications/pull/242
https://deploy-preview-242--jakartaee-specifications.netlify.app/specifications/cdi/3.0/

 

Per the process, this will be a fourteen day ballot, ending on September 14, 2020 that requires a Super-majority positive vote of the Specification Committee members (note that there is no veto). Community input is welcome, but only votes cast by Specification Committee Representatives will be counted.

 

The Specification Committee is composed of representatives of the Jakarta EE Working Group Member Companies (Fujitsu, IBM, Oracle, Payara, Red Hat, Tomitribe, and Primeton), along with individuals who represent the EE4J PMC, Participant Members, and Committer Members.

 

Specification Committee representatives, your vote is hereby requested. Please respond with +1 (positive), 0 (abstain), or -1 (reject).  Any feedback that you can provide to support your vote will be appreciated.


Thanks!



---------------------------------------------------
Kevin Sutter
STSM, MicroProfile and Jakarta EE architect @ IBM
e-mail:  sutter@xxxxxxxxxx     Twitter:  @kwsutter
phone: tl-553-3620 (office), 507-253-3620 (office)    
LinkedIn:
https://www.linkedin.com/in/kevinwsutter
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